Quantum Packaging Engineer: Die Dicing & Bonding
Listed on 2026-11-04
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Engineering
Manufacturing Engineer, Electronics Engineer, Process Engineer, Packaging Engineer
Amazon Development Center U.S., Inc. in Pasadena, CA is seeking a Hardware Development Engineer with hands-on experience in semiconductor process development, die singulation, probing, wire bonding and flip chip bonding to advance quantum computing product chips.
You will work in the cleanroom and pursue reliable, scalable packaging and test methods. You will collaborate with cross-functional teams to analyze process data, improve yield, and implement standardized workflows that support rapid
The Quantum Packaging Engineer:
Die Dicing & Bonding role at Amazon Inc. is now open for applications in Pasadena, CA, United States.
The position is based in Pasadena, CA, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 75..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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