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Product Development Engineer

Job in Yocumtown, York County, Pennsylvania, USA
Listing for: Amphenol Corporation
Full Time position
Listed on 2026-10-10
Job specializations:
  • Engineering
    Electronics Engineer, Systems Engineer, Electrical Engineering
Salary/Wage Range or Industry Benchmark: 120000 - 170000 USD Yearly USD 120000.00 170000.00 YEAR
Job Description & How to Apply Below

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world’s largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales.

We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.

Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile, RF, Optics, and Commercial electronics markets. Amphenol Corporation is one of the world’s largest designers and manufacturers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. ACS has an expansive global presence in research and development, manufacturing, and sales.

We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment, and automotive.

Position: STAFF Product Development Engineer

Location:

Valley Green, PA

We are seeking a highly experienced STAFF Product Development Engineer to lead the development of next-generation high-speed interconnect and connector solutions for AI infrastructure, hyperscale data centers, networking switches, and near-chip/co-packaged applications.

This is an individual-contributor role for an engineer who is already operating at a high level of technical independence. The ideal candidate has successfully taken complex electromechanical or interconnect products from early concept through design validation, customer qualification, manufacturing release, and production ramp. This person should be comfortable working with ambiguous customer requirements, advanced manufacturing technologies, tight mechanical/electrical constraints, and fast-moving cross-functional teams.

The work is highly collaborative, technically challenging, and directly tied to the future of AI and high-performance networking systems. Co-packaged copper/optics and near-package interconnect approaches are increasingly important in data-center networking as AI workloads drive higher bandwidth, lower power, and denser switch architectures.

What You Will Do

You will own product development activities for advanced high-speed connector and interconnect systems used in AI, hyperscale, and networking switch environments.

Key responsibilities include:

  • Lead development of new high-speed connector, cable, socket, interposer, near-package, or co-packaged interconnect products from concept through production release.
  • Translate customer needs, system-level requirements, and market direction into practical product architectures and manufacturable designs.
  • Drive early concept generation, feasibility studies, mechanical architecture, material selection, tolerance strategy, and design tradeoff analysis.
  • Work closely with signal integrity, mechanical engineering, process engineering, manufacturing, quality, test, suppliers, and customer-facing teams.
  • Develop products that balance electrical performance, mechanical robustness, manufacturability, cost, reliability, thermal behavior, and scalability.
  • Lead design reviews, risk assessments, DFM/DFA reviews,…
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