Process and Integration Engineer, Optoelectronics

Process and Integration Engineer – Optoelectronics

We are seeking a highly skilled Process Integration Engineer to join our Optical Systems Division. This position is pivotal to the efficient and profitable manufacturing of microelectronic laser and detector products in a 100% on‑site, 24/7 production environment. The successful candidate will serve as the technical authority for the facet coating process, driving improvements in productivity, yield, quality, and reliability across internal operations and subcontractor facilities while collaborating cross‑functionally to meet critical production commitments.

• Process Engineering & Optimization
  • Lead the development, optimization, and scaling of complex multilayer coatings (AR, HR, and passivation layers) using Ion Beam Sputtering (IBS).
  • Design and execute experiments (DOE) to improve manufacturing efficiency and optimize batch processes.
• Technical Leadership & Operations
  • Serve as the technical lead for facet coating and backend operations, including wafer scribing, laser bar handling, and Automated Visual Inspection (AVI).
  • Manage equipment life cycles, from defining requirements for new tool acquisitions to leading the qualification and buy‑off of engineering upgrades.
• Quality & Data Analysis
  • Implement robust process control plans, SPC, FMEA, and OCAP.
  • Utilize spectroscopic ellipsometry, spectrophotometry, and AFM for metrology.
  • Conduct deep‑diving root‑cause analyses and implement corrective and preventive actions (CAPA) to mitigate defects and process excursions.
• Strategic Collaboration
  • Partner with internal Product, Quality, and R&D teams, as well as external foundries, to align technical goals.
  • Manage subcontractor performance across regions via remote monitoring and maintain SOPs and technical documentation.
• Reporting
  • Establish KPIs and dashboards to monitor daily performance, cycle times, and process health; communicate findings through periodic reports to management.

• Education
  • Master’s degree in Materials Science, or Optical, Chemical, or Electrical Engineering.
• Experience
  • Minimum of 6 years of experience in semiconductor manufacturing, with at least 4 years of hands‑on experience in thin‑film deposition, specifically for optoelectronic devices.
• Technical Proficiency
  • Solid understanding of vacuum physics and deposition techniques (IBS, ALD) and dielectric coating materials (e.g., Al₂O₃, SiO₂, Ta₂O₅, TiO₂, Si₃N₄).
• Analytical Skills
  • Strong background in statistical data analysis; proficiency with SPC, DOE, FMEA, DMAIC, and advanced tools such as JMP, SQL, and Tableau.
• Operational Knowledge
  • Experience with automated bar‑handling, wafer scribing and cleaving, Pick‑and‑Place (PnP), AVI tools, Burn‑in, and mechanical engineering fundamentals.
• Soft Skills
  • Excellent written and verbal communication, detail‑oriented problem‑solving capabilities, and a proactive, action‑oriented mindset.
• Preferred
  • Ph.D. in Materials Science, or Optical, Chemical, or Electrical Engineering with at least 3 years of experience in semiconductor manufacturing.
  • Proven knowledge and practical application of Lean manufacturing methodologies.

The Breinigsville, PA, manufacturing location was created by AT&T in the late 1980s as Bell Laboratories’ world headquarters for optoelectronics. Through a series of acquisitions, this facility is now an integral part of Broadcom’s Optical Systems Division, manufacturing indium phosphide lasers and detectors that support telecommunications and datacenter customers worldwide. Located in the Lehigh Valley region of Pennsylvania just outside Allentown, the high‑volume, 24/7 facility fabricates devices that enable fiber‑optic communication and datacenter expansion.

• Annual base…