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Director of Semiconductor Packaging
Job in
Cambridgeshire and Peterborough, Peterborough, Cambridgeshire, PE1, England, UK
Listed on 2026-10-10
Listing for:
Intellectual Capital Resources Ltd
Full Time
position Listed on 2026-10-10
Job specializations:
-
Engineering
Packaging Engineer
Job Description & How to Apply Below
A growing semiconductor client is currently seeking a Director of Semiconductor Packaging to lead the development of advanced, high-performance packaging solutions for GaN power semiconductors. The role combines technical leadership, people leadership and hands‑on engineering. The successful candidate will set the packaging strategy, build team capability, influence company-wide decisions and work closely with internal teams and external packaging/manufacturing partners.
Key Responsibilities- Lead the design and development of high-performance, high-density semiconductor packages for GaN power products
- Develop technologies including wirebond, flip-chip, embedded packaging and wafer back‑end processes
- Balance electrical, thermal, mechanical, cost, quality and form‑factor requirements
- Lead packaging development with overseas assembly houses and technology suppliers
- Support package verification, qualification, reliability and thermal testing
- Drive design‑for‑manufacture, design processes and engineering tools to achieve right‑first‑time designs
- Conduct first‑article inspection and failure analysis
- Provide packaging expertise to Applications Engineering and customers
- Contribute significantly to the product and technology roadmap
- Build external networks and maintain awareness of state‑of‑the‑art semiconductor packaging
- Degree or higher in Engineering, Physics, Materials Science or a related discipline
- Strong experience designing and manufacturing high‑volume semiconductor power packages, including working with overseas assembly houses
- Deep knowledge of packaging technologies including:
- Die attach / Ag‑sintering
- Flip‑chip
- Wire bonding
- Copper clip
- PCB embedding
- Chip metallisation
- Strong 3D CAD experience and knowledge of supplier design rules/DFM
- Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent
- Experience with thermal characterisation of semiconductor packages
- Experience with package qualification/reliability testing, including TCoB, MSL, TC, HAST and HTS, against relevant standards
- Strong cross‑functional leadership and supplier‑management skills
- Ability to manage priorities independently and deliver results
- Confident presenting technical results to internal and external stakeholders
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