3D Chiplet Architect Bandwidth Memory Packaging
Listed on 2026-11-05
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Engineering
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Design & Architecture
Vertical Compute SRL is seeking a 3D Integration / Chiplet Expert to define and implement 2.5D/3D packaging strategies for the VIM technology. You will shape interconnect approaches and die stacking to enable high-bandwidth, low-power operation across SoC and package boundaries.
The role requires 5–10 years in advanced packaging, deep SoC design knowledge, and strong collaboration across design, process, and system teams.
As a 3D Chiplet Architect — High-Bandwidth Memory Packaging, you will play an important part at Vertical Compute SRL in United States.
Are you ready to take on the 3D Chiplet Architect — High-Bandwidth Memory Packaging role at Vertical Compute SRL?
We would love to welcome a new 3D Chiplet Architect — High-Bandwidth Memory Packaging to our organisation in United States.
For the 3D Chiplet Architect — High-Bandwidth Memory Packaging position at Vertical Compute SRL, we are reviewing applications now.
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