Senior Packaging Design Architect — Substrate & IC
Listed on 2026-10-13
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Design & Architecture
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Engineering
Hardware Engineer
Intel Corporation seeks an experienced Packaging Design Architect to drive end-to-end substrate design from concept through tape-out, and to implement physical layout and routing of the package design.
You'll collaborate with silicon and hardware teams to optimize silicon-package-board performance, define substrate design rules, and resolve DRCs while documenting progress in the product lifecycle system.
We would love to welcome a new Senior Packaging Design Architect — Substrate & IC to our organisation in Phoenix, AZ, United States.
The Senior Packaging Design Architect — Substrate & IC position in the IT & Technology, Engineering field is open for applications.
We have an opening for a Senior Packaging Design Architect — Substrate & IC in Phoenix, AZ, United States within IT & Technology, Engineering.
This role, Senior Packaging Design Architect — Substrate & IC at Intel Corporation, could be your next move.
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