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Senior Hardware Engineer

Job in Phoenix, Maricopa County, Arizona, 85003, USA
Listing for: Intel Corporation
Full Time position
Listed on 2025-12-02
Job specializations:
  • Engineering
    Electrical Engineering, Systems Engineer, Electronics Engineer, Hardware Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Job Title

Senior Hardware Engineer

Overview

Intel® Integrated Photonics Solutions (IPS) is at the forefront of silicon photonics integration and is part of The Data Center Group, which powers the cloud and billions of smart, connected computing devices. Since announcing the world’s first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting‑edge technology and efficient, scalable high‑volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics drives future data center bandwidth growth with smaller form factors, co‑packaging, and higher speeds from 400G today to 1.6T+ and beyond tomorrow.

We are looking for a highly experienced Hardware Designer with expertise in signal integrity (SI) and physical implementation (PI) to support the development of reference module designs, PIC sub‑system EVBs, and other test boards.

Responsibilities
  • Perform SI simulations of high‑speed interfaces, RF traces, etc. (100

    Gbps, 200

    Gbps NRZ and PAM4 signaling).
  • Model high‑speed traces with vias, connectors, sockets, and various system components in 3D EM tools like HFSS and ADS.
  • Design and optimize Power Delivery Network (PDN) across packages and PCBs.
  • Perform PI simulations for IR drop, current density violations, dynamic switching noise analysis to validate board designs.
  • Design 100G/lane and 200G/lane module PCBA, lead layout execution for high‑speed traces, and manage trade‑offs in design.
  • Lead hardware design of an optical transceiver and evaluation boards, including schematic design, circuit simulation, PCB layout, floor planning, and design review.
  • Lead PCB bring‑up, work with firmware engineers to confirm functionality against design targets, and validate PCBA through independent characterization.
  • Troubleshoot and optimize performance of sub‑system/transceiver module boards.
  • Select DSP, driver, TIA, microcontrollers, DACs, ADCs, voltage regulators, etc., for module design.
  • Own PCBA design from concept through full final design and EVT/DVT phases.
  • Understand electrical and optical requirements of optical transceivers (800G DR8/2xFR4, 1.6T DR8/2xFR4, 800G LPO, 1.6T LRO, etc.).
  • Maintain design specifications, pass design checklists prior to tape‑out, manage BOM specifications, and coordinate with NPI team.
  • Lead design reviews, present design summaries, highlight risks with mitigation plans.
  • Collaborate with mechanical, optical, photonics, firmware, process, and test engineers.
  • Interface with program managers, buyers/planners, and suppliers to ensure parts availability.
Qualifications

Minimum Qualifications

  • M.S. in Electrical Engineering.
  • 4+ years of hardware/circuit design experience.
  • 4+ years of experience in transceiver electrical design principles, high‑speed signal integrity, crosstalk, power integrity, noise, ESD, firmware, testing, and layout.
  • Experience with PI and SI tools (HFSS, ADS, Cadence).
  • Experience with high‑density multiple‑layer board design and high‑volume PCB/substrate fab houses.

Preferred Qualifications

  • Ph.D. in Electrical Engineering.
  • Strong analog and digital circuit design skills and mixed‑signal layout.
  • Experience with AWG, DCAM, VNA/LCA for high‑speed characterization.
  • Strong laboratory optical and electrical measurement skills.
  • Strong communication and presentation skills.
  • Experience with micro‑controllers and communication protocols (SPI, I2C, MDIO, CMIS).
  • Background in digital communication theory.
  • Familiarity with IEEE Ethernet standards, OIF standards, PCIe standards, and various MSAs.
  • Experience with optical transceiver test and calibration methodologies.
  • Experience working with Marvell, Broadcom, Max Linear, and Credo DSPs in pluggable optical modules.
Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, California, Santa Clara

Additional Locations

US, Arizona, Phoenix

Seniority level

Mid‑Senior level

Employment type

Full‑time

Job function

Engineering and Information Technology

Industries

Semiconductor Manufacturing

Business Group

The Data Center Group (DCG) is committed to delivering exceptional products and delighting our customers, offering broad‑market Xeon‑based solutions and custom x86‑based products for compute, web services, HPC, and AI‑accelerated systems.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sexual orientation, or any other characteristic protected by local law.

Benefits

We offer a total compensation package that includes competitive pay, stock, bonuses, health, retirement, and vacation benefits. Find more information about our benefits here.

Annual Salary Range

$ - $ USD

Work Model

This role will require an on‑site presence.

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Position Requirements
10+ Years work experience
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