External Technology Integration Engineer

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** Welcome!**## .External Technology Integration Engineer page is loaded## External Technology Integration Engineer locations:
US, Arizona, Phoenix:
US, Oregon, Hillsborotime type:
Full time posted on:
Posted Yesterday job requisition :
JR0278660#
** Job Details:**##

Job Description:

** Transform Technology. Lead Innovation. Make Your Mark.
** This is more than just an engineering role—it's an opportunity to be at the forefront of semiconductor innovation, working with industry-leading technologies like High Bandwidth Memory (HBM), LP DDRs and Si nodes while collaborating with world-class internal teams and external partners. As our External Technology Integration Engineer, you'll drive critical technology milestones from concept to production, establishing the standards, design rules and specifications that will define the next generation of computing solutions.
** What You'll Accomplish:
*** Lead the technical integration of external memory and/or foundry silicon technologies into Intel's advanced packaging platforms
* Drive comprehensive chip-to-package interaction (CPI) assessments across Si backend fab, bump, singulation, assembly, and test domains
* Qualify breakthrough foundry Si/memory technologies and establish innovative Si far back-end and bump design rules
* Orchestrate complex technical programs with multi-disciplinary stakeholders to deliver game-changing results
* Define package performance specifications and achieve technology certification through strategic test vehicle design layout and data collections
* Pioneer research on materials and properties to solve complex CPI failure mechanisms
* Establish critical material and process specifications for foundries and contract assemblers
* Lead and influence both internal and external stakeholders towards desired direction and timely execution.
* Provide succinct presentations to senior executive management team along with excellent verbal and written communication skills.##
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* Qualifications:

** You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
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* Minimum Qualifications:

**** Education and Experience Requirements
*** Bachelor's degree in Materials, Chemical Engineering, Chemistry, Physics, Mechanical Engineering with 6 years related field experience
* Master's degree in Materials, Chemical Engineering, Chemistry, Physics, Mechanical Engineering with 4 years related field experience
* PhD degree in Materials, Chemical Engineering, Chemistry, Physics, Mechanical Engineering with 2 years related field experience
** Technical Experience Requirements
**** Manufacturing Process Integration
*** 2 years developing and qualifying microelectronic packaging processes for high-volume manufacturing (OR)
* 2 years integrating complex packaging assembly components including design specifications, manufacturing processes, materials selection, and tooling requirements (OR)
* 2 years managing technical programs with demonstrated experience in: (OR)  + Technical planning and scheduling  + Program execution and monitoring  + Completion of packaging assembly process certifications
* 2 years managing external relationships including:  + Supplier process, material, and tool management  + Customer program management with committed delivery schedules## Job Type:Experienced Hire##

Shift: Shift 1 (United States of America)## Primary

Location:

US, Arizona, Phoenix## Additional Locations:

US, Oregon, Hillsboro## Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and…