More jobs:
Advanced IC Packaging Tools Engineer; Hybrid
Job in
Phoenix, Maricopa County, Arizona, 85003, USA
Listed on 2026-01-01
Listing for:
Intel
Full Time
position Listed on 2026-01-01
Job specializations:
-
Engineering
Systems Engineer
Job Description & How to Apply Below
A leading semiconductor company in Phoenix, Arizona, is seeking an experienced Advanced IC Packaging Software Engineer to work with Intel foundry customers. This role focuses on advanced packaging technologies, design tool implementation, and requires strong skills in C/C++, algorithms, and EDA tools. Ideal candidates will hold a Bachelor's or Master's degree in Computer Science or Electrical Engineering and have relevant experience.
The position offers a hybrid work model and a competitive compensation package including salary ranging from $109,070 to $206,860 annually.
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