Media & Collateral Packaging Engineer
Listed on 2026-10-07
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Engineering
Packaging Engineer
Intel in Phoenix, AZ is seeking a Packaging Module Development Engineer to shape the development and optimization of assembly media and collaterals. You will design solutions to improve reliability, manufacturability, and cost efficiency across the packaging technology roadmap.
Join Intel's Media Development group to advance semiconductor packaging processes, apply DOE and SPC techniques, and contribute to high-impact projects with cross-functional teams in an on-site setting.
We are currently recruiting a Media & Collateral Packaging Engineer for our team in Phoenix, AZ, United States.
We appreciate your interest in this position.
Join Intel and contribute to our ongoing work.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Media & Collateral Packaging Engineer role at Intel, based in Phoenix, AZ, United States.
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