Packaging Process Innovator — DOE & SPC Engineer
Listed on 2026-10-11
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Engineering
Process Engineer, Packaging Engineer, Manufacturing Engineer, Quality Engineering
Intel Corporation in Arizona is seeking a Packaging Process Development Engineer to advance next-generation semiconductor packaging technologies. You will develop and optimize assembly media and collateral processes while applying DOE and SPC to improve quality, yield, and reliability.
You will collaborate with suppliers and internal teams to ensure manufacturability, define material specs, and drive continuous improvement across full manufacturing workflows.
We invite applications for the Packaging Process Innovator — DOE & SPC Engineer position located in Phoenix, AZ, United States.
As a Packaging Process Innovator — DOE & SPC Engineer, you will play an important part at Intel Corporation in Phoenix, AZ, United States.
The following role is for a Packaging Process Innovator — DOE & SPC Engineer with Intel Corporation.
Our organisation is growing, and we are hiring a Packaging Process Innovator — DOE & SPC Engineer in Phoenix, AZ, United States.
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