Packaging Media & Collateral Innovation Engineer
Listed on 2026-10-13
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Engineering
Packaging Engineer
Intel Corporation in Phoenix, AZ is seeking a Packaging Module Development Engineer to advance media and collateral solutions for assembly packaging. You will design, test, and optimize media reliability, cost, and manufacturability, and apply DOE and SPC to drive improvements.
You will lead efforts to mitigate quality risks, consult on technical challenges, and document innovations for internal reviews and knowledge sharing.
We have an opening for a Packaging Media & Collateral Innovation Engineer in Phoenix, AZ, United States within Engineering.
This role, Packaging Media & Collateral Innovation Engineer at Intel Corporation, could be your next move.
Are you ready to take on the Packaging Media & Collateral Innovation Engineer role at Intel Corporation?
We would love to welcome a new Packaging Media & Collateral Innovation Engineer to our organisation in Phoenix, AZ, United States.
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