Module Engineer Shift — xSemiconductor Packaging
Listed on 2026-10-13
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Engineering
Packaging Engineer, Manufacturing Engineer, Electrical Engineering
Intel Corporation in Chandler, Arizona is seeking a Module Engineer On Shift (MEOS) to join our Substrate Packaging Technology Development team. You will be part of a 24x7 manufacturing operation, providing real-time factory support to keep the production line moving.
The role emphasizes problem solving, clear communication, and attention to detail in a fast-paced environment. Shift 5 runs 6:00 AM–6:00 PM with alternating 3- and 4-day weeks; on-site work with competitive compensation and
The Module Engineer On Shift — 24x7 Semiconductor Packaging position in the Engineering field is open for applications.
Full responsibilities and requirements are described in the listing above.
Learn more about the Module Engineer On Shift — 24x7 Semiconductor Packaging role in the description above.
We appreciate your interest in this position.
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