Senior Thermal & Packaging Research Engineer
Listed on 2026-10-15
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Engineering
Mechanical Engineer, Systems Engineer, Electrical Engineering, Packaging Engineer
Intel Corporation in Phoenix, AZ is seeking a Thermal Analysis Engineer to drive research on advanced semiconductor devices, packages, and interconnects. You will design, fabricate, and test prototypes, applying device physics and thermomechanical analysis to optimize performance and cost.
The role requires hands-on experimentation, collaboration across device, reliability, and fabrication teams, and expertise in DOE, simulations (Ansys/Abaqus), and programming (Python/MATLAB).
Step into the Senior Thermal & Packaging Research Engineer role at Intel Corporation in Phoenix, AZ, United States and grow with us.
We have an opening for a Senior Thermal & Packaging Research Engineer in Phoenix, AZ, United States within Engineering.
This role, Senior Thermal & Packaging Research Engineer at Intel Corporation, could be your next opportunity.
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