Advanced Packaging Metrology Engineer Site
Listed on 2026-10-15
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Engineering
Quality Engineering, Packaging Engineer, Process Engineer
Intel Corporation's Advanced Packaging Technology and Manufacturing (APTM) seeks a Metrology Equipment Engineer to drive process control, manufacturing data analytics and yield improvement for Thermal Compression Bonding technologies. You will develop and sustain metrology systems and inspection equipment to support Intel's roadmap for advanced packaging.
The role emphasizes DOE, MSA, data analysis with Python/Excel/SQL, and collaboration with suppliers and internal teams to ensure data
We are currently recruiting a Advanced Packaging Metrology Engineer – On‑Site for our team in Phoenix, AZ, United States.
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This posting is for the Advanced Packaging Metrology Engineer – On‑Site role at Intel Corporation, based in Phoenix, AZ, United States.
We are looking to fill the Advanced Packaging Metrology Engineer – On‑Site position at Intel Corporation in Phoenix, AZ, United States.
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