RF Test Process Engineer: Advanced Packaging
Listed on 2026-10-15
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Engineering
Electronics Engineer, Test Engineer, Process Engineer
Intel Corporation in Phoenix, AZ, seeks a Radio Frequency Test Process Engineer to join the STTD team within Intel’s Advanced Packaging Technology Manufacturing. You will lead the design, development, and optimization of advanced RF test and manufacturing solutions to support next‑gen silicon, collaborating across customers and suppliers to deliver high‑impact results.
Applicants should hold a STEM degree with 4+ years of industry experience, plus hands‑on RF lab proficiency and ATE/IC testing
The following opportunity is for a RF Test Process Engineer:
Advanced Packaging with Intel Corporation.
This opportunity is part of our work in Engineering.
The advertised compensation is 115..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the RF Test Process Engineer:
Advanced Packaging role in the description above.
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