Senior Silicon Packaging Architect — End-to-End Solutions
Listed on 2026-10-16
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Engineering
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Design & Architecture
Intel Corporation in Phoenix, AZ seeks a Senior Silicon Packaging Design Architect to lead end-to-end package solutions, driving electrical, mechanical, and cost targets while translating product requirements into robust package architectures.
You will work with silicon, hardware, and packaging teams to deliver high-quality designs, resolve reliability challenges, and implement co-design strategies with board teams to improve performance and cost efficiency.
This opportunity is for the Senior Silicon Packaging Architect — End-to-End Solutions role at Intel Corporation.
Take a moment to read everything above and see whether this role is right for you.
This posting is for the Senior Silicon Packaging Architect — End-to-End Solutions role at Intel Corporation, based in Phoenix, AZ, United States.
We are looking to fill the Senior Silicon Packaging Architect — End-to-End Solutions position at Intel Corporation in Phoenix, AZ, United States.
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