CMP Module Process Engineer IV E4

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry.

The work we do together advances the world’s technology.

Salary: $ - $

Location:

Boise, , Dallas, TX, Hillsboro, OR, Phoenix, AZ, Santa Clara, CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible - while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

• Must be a technical expert with 10+ years’ experience in Chemical Mechanical Planarization (CMP) Process with a strong Wafer Fab background.

• Must have data analytics background for performing analysis to identify, troubleshoot, and solve complex CMP Process, Yield, and Integration related problems.

• Lead discussions with customers to understand their High Value Problems (HVP), propose and implement new Continuous Improvement Projects (CIP), capture learning to maximize service opportunities and implement the solutions to improve customer KPI's

• Increases CSA value through defect / variability / COO reduction and PM /process Cpk / matching / Output optimization.

• Identifies opportunities for CSA renewal /upsell /penetration

• Demonstrates & drives the adoption of new service technologies including Fab Vantage Offerings at the customer site through Demos, on site evaluations and Joint Development Programs

• Resolves complex tool issues utilizing analytics, equipment, and process knowledge and systematic Fab Vantage troubleshooting methodologies for effective root cause diagnostics and issues resolution. Can Issue the report and present to customer which including explain the priority and provide the suggestion based on the compare BOM, EC, FSS data and FV360 for two products.

• Mentor/Lead junior level MPE's

• Advanced integration knowledge

• Domain knowledge of 4 or more processes on 2 or more technologies

• Lead and contribute to CMP network of experts and Community of Practice

• BS - Engineering

• 10+ years of experience in Chemical Mechanical Planarization (CMP) Process

• Wafer Fab / Equipment experience

• Communicates complex ideas, anticipates potential objections, and persuades others, often at senior levels, to adopt a different point of view

• Regarded as the technical expert in CMP Unit Process and Wafer Fab operations

Time Type:
Full time

Employee Type:
Assignee / Regular

Travel:
Yes, 20% of the Time

Relocation Eligible:
Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum…