Module Engineer - Foundry Packaging & Process Innovation
Listed on 2026-10-17
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Engineering
Manufacturing Engineer, Process Engineer, Packaging Engineer, Quality Engineering -
Manufacturing / Production
Manufacturing Engineer, Packaging Engineer, Quality Engineering
Intel Corporation is seeking a Module Engineer for its Foundry Technology Manufacturing unit in Phoenix, AZ. You will develop and optimize assembly processes and equipment for next-generation foundry packaging, applying innovative concepts across engineering, manufacturing, and technology development.
You will design and implement DOE-driven process specs, enhance reliability screening, and drive continuous improvement using statistical methods to support key product milestones.
We are currently recruiting a Module Engineer
- Foundry Packaging & Process Innovation for our team in Phoenix, AZ, United States.
For the Module Engineer
- Foundry Packaging & Process Innovation position at Intel Corporation, we are reviewing applications now.
Step into the Module Engineer
- Foundry Packaging & Process Innovation role at Intel Corporation in Phoenix, AZ, United States and grow with us.
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