IC Package Design Engineer – Hybrid; Tempe
Listed on 2026-10-17
-
Engineering
Engineering Design & Technologists, Systems Engineer, CAD/ AutoCAD/ Mechanical Design
Amkor Technology, Inc. seeks an IC Package Design Engineer for its Tempe, Arizona location. You will design laminate (BGA) and wafer-level packages, create precise drawings, and troubleshoot design challenges for thermal, mechanical, and electrical requirements.
This role emphasizes collaboration with cross-functional teams and customers to deliver robust package solutions. You will work with CAD tools to produce detailed engineering drawings, support design reviews, and contribute to process
Join us at Amkor Technology, Inc. as our next IC Package Design Engineer – Hybrid (Tempe) in Phoenix, AZ, United States.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the IC Package Design Engineer – Hybrid (Tempe) role in the description above.
We appreciate your interest in this position.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).