Semiconductor Packaging Module Engineer
Listed on 2026-10-20
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Engineering
Packaging Engineer, Manufacturing Engineer, Process Engineer, Quality Engineering
Intel Corporation's Epoxy MEOS team in Arizona seeks a Packaging Module Development Engineer to advance assembly and packaging processes for next-generation semiconductor products. You will design and optimize packaging solutions, applying SPC and DOE to ensure quality, reliability, cost, yield, and manufacturability.
You will collaborate with suppliers and cross-functional teams in a fast-paced environment, contributing to meaningful projects while growing your technical expertise in a leading
As a Semiconductor Packaging Module Engineer, you will play an important part at Intel Corporation in Phoenix, AZ, United States.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Semiconductor Packaging Module Engineer role in the description above.
We appreciate your interest in this position.
Join Intel Corporation and contribute to our ongoing work.
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