Wiresaw Process Engineer - Diamond Wire & Slurry; Global
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Engineering
Process Engineer
Job Description & How to Apply Below
CPG Talent Management LLC is seeking a Wiresaw Process Engineer
- Wafer Slicing (Diamond Wire & Slurry) for the United States with flexible remote options. The role focuses on leading edge process development and close collaboration with global customer teams.
You will own DCW and slurry wire slicing processes, drive DOE/SPC-driven improvements, lead equipment startups at customer sites, and travel ~75% domestically and internationally as needed.
Consider building your career as a Wiresaw Process Engineer
- Diamond Wire & Slurry (Global) at CPG Talent Management LLC.
This role, Wiresaw Process Engineer
- Diamond Wire & Slurry (Global) at CPG Talent Management LLC, could be your next opportunity.
Are you ready to take on the Wiresaw Process Engineer
- Diamond Wire & Slurry (Global) role at CPG Talent Management LLC?
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