Software Engineer, Advanced IC Packaging Tools

Job Details

The world is transforming, and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings.

We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM
2.0) strategy, we are establishing Intel Foundry, a fully vertical, stand‑alone foundry business, reporting directly to the CEO. Intel Foundry will be a world‑class foundry business and major provider of US‑based capacity to serve customers globally.

Foundry Services is already engaged with customers today starting with our existing foundry offerings. We are expanding rapidly to include our most advanced technologies, which are ideal for high-performance applications, and are completely dedicated to the success of our customers with full profit and loss responsibilities. Using this model will ensure that our foundry customers' products receive our utmost focus in terms of service, technology enablement, and capacity commitments.

Foundry Services will be differentiated from other foundries with a combination of leading‑edge packaging and process technology, committed capacity in the US and Europe, and a world‑class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IPs, along with Arm and RISC‑V ecosystem IPs.

Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages.

• The Advanced IC Packaging Software Engineer will work closely with Intel foundry customers on advanced packaging technologies to define, develop, and implement design tools, flows, automation and methodologies for system co‑design, design implementation, and verification.
• Serve as the technical expert on design tools as well as consult on design and implementation issues.
• Utilize modern software development methodologies, programming languages, domain knowledge, and secure coding practices to design, develop, debug, and/or validate algorithms, software tools, and systems that enable our internal/external engineering partners to design/manufacture Intel silicon, integrate Intel silicon and/or software into impactful products.

• Self‑driven and results‑oriented and able to multi‑task and work in a fast‑paced worldwide environment.
• Analytical problem‑solving skills.
• Effective communication skills and experience in collaborating with stakeholders and customers.

• Bachelor's Degree in Computer Science, Electrical Engineering or related disciplines and 2+ years of relevant experience.
• Master's Degree in Computer Science, Electrical Engineering or related disciplines and 1+ year of relevant experience.

• Experience with C/C++ with STL and Boost libraries.
• Data structures and algorithms.
• Computational Geometry.
• Experience with EDA Tools such as Cadence Integrity, Siemens Innovator 3D, Cadence Advanced Package Designer, Siemens Mentor Xpedition.
• Software design and architecture.
• Scripting experience in Tcl, Python, SKILL, VBScript, or Perl.
• Understanding of AI and ML fundamentals.
• Experience with Agile and Scrum development practices.
• Previous related work experience in a semiconductor foundry preferred.

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)
Primary

Location:

US, Arizona, Phoenix
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state‑of‑the‑art while delighting our customers—the AI era, global manufacturing scale, advanced packaging through final test and…