Principal IC Package Design Engineer; SI/PI
Listed on 2026-10-11
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Engineering
Electronics Engineer, Systems Engineer, Test Engineer, Engineering Design & Technologists
Ciena Corporation invites applications for an SI/PI Design Engineer to lead the electrical package design for custom in-house photonic, analog, and digital ICs powering next‑generation optical modules.
You will own advanced package selection, BGA configurations and package structures, and oversee layout, verification, and tapeout. Collaboration across teams will optimize silicon floor plans and interposers, with SIWave/HFSS-based simulations guiding decisions.
The Principal IC Package Design Engineer (SI/PI) position in the Engineering field is open for applications.
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Principal IC Package Design Engineer (SI/PI) role in the description above.
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