CMP Module Process Engineer IV E4

CMP Module Process Engineer IV - (E4)
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Apply locations:
Boise,:
Hillsboro,ORtime type:
Full time posted on:
Posted Todayjob requisition :
R2618955
** Who We Are
** Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.
** What We Offer
** Salary:$ - $

Location:

Boise,, Hillsboro,ORYou’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
** Role Responsibilities
*** Must be a technical expert with 10+ years’ experience in Chemical Mechanical Planarization (CMP) Process with a strong Wafer Fab background.
* Must have data analytics background for performing analysis to identify, troubleshoot, and solve complex CMP Process, Yield, and Integration related problems.
* Lead discussions with customers to understand their High Value Problems (HVP), propose and implement new Continuous Improvement Projects (CIP), capture learning to maximize service opportunities and implement the solutions to improve customer KPI's
* Increases CSA value through defect / variability / COO reduction and PM /process Cpk / matching / Output optimization.
* Identifies opportunities for CSA renewal /upsell /penetration
* Demonstrates & drives the adoption of new service technologies including Fab Vantage Offerings at the customer site through Demos, on site evaluations and Joint Development Programs
* Resolves complex tool issues utilizing analytics, equipment, and process knowledge and systematic Fab Vantage troubleshooting methodologies for effective root cause diagnostics and issues resolution. Can Issue the report and present to customer which including explain the priority and provide the suggestion based on the compare BOM, EC, FSS data and FV360 for two products.
* Mentor/Lead junior level MPE's
* Advanced integration knowledge
* Domain knowledge of 3 or more types of CMP processes and familiarity with Applied equipment.
* Lead and contribute to CMP network of experts and Community of Practice
*
* Qualifications:

*** BS - Engineering
* 10+ years of experience in Chemical Mechanical Planarization (CMP) Process
* Wafer Fab Process / Equipment experience
* Communicates complex ideas, anticipates potential objections, and persuades others, often at senior levels, to adopt a different point of view
* Regarded as the technical expert…