Advanced Lead – SiC​/GaN Power Module Packaging Engineer

Join to apply for the Advanced Lead – SiC/GaN Power Module Packaging Engineer role at GE Aerospace

Join to apply for the Advanced Lead – SiC/GaN Power Module Packaging Engineer role at GE Aerospace

Job Description Summary

At GE Aerospace, we are dedicated to pushing the boundaries of aviation technology and innovation. We are looking for passionate and talented individuals to join our team and contribute to our mission. If you are driven by excellence and eager to be part of a dynamic and forward-thinking organization, we invite you to explore the exciting opportunities we have to offer.

Job Description Summary

At GE Aerospace, we are dedicated to pushing the boundaries of aviation technology and innovation. We are looking for passionate and talented individuals to join our team and contribute to our mission. If you are driven by excellence and eager to be part of a dynamic and forward-thinking organization, we invite you to explore the exciting opportunities we have to offer.

A GaN (Gallium Nitride) and SiC (Silicon Carbide) Power Module Packaging Engineer focuses on the design of power modules along with development, optimization, and implementation of manufacturing processes for both GaN and SiC power modules. These advanced semiconductor power modules are critical for high-efficiency high power density power electronics.



Job Description

The Power Module Packaging Engineer is responsible for developing, optimizing, and implementing manufacturing processes for existing and new Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules. This individual will participate in power module design and simulation analyses, and will work closely with mechanical designers, quality, and production teams to ensure the efficient and reliable production of high-performance GaN and SiC power modules.

The engineer will also be involved in troubleshooting, process improvement, and ensuring compliance with industry standards and safety regulations.



Key Responsibilities

Power Module Design and Simulation

• Collaborate with power module design team, provide insight on the developed module performance using simulation tools.
• Collaborate with design and R&D teams to ensure manufacturability and scalability of new GaN and SiC power module designs.

• Develop and optimize manufacturing processes for GaN and SiC power modules, including die attach, wire bonding, encapsulation, and testing.

• Identify and implement process improvements to enhance yield, efficiency, and reliability of GaN and SiC power module production.
• Utilize statistical process control (SPC) and other quality tools to monitor and improve process performance.

• Develop and implement quality control procedures to ensure compliance with industry standards and customer requirements.
• Conduct root cause analysis and implement corrective actions to address process-related quality issues.

• Guide the team to maintain detailed process documentation, including process flow diagrams, work instructions, and standard operating procedures (SOPs).
• Prepare technical reports and presentations to communicate process development and improvement activities.

• Train production staff on new processes and equipment.
• Provide technical support to production teams to resolve process-related issues.

• Ensure all manufacturing processes comply with safety regulations and company policies.
• Participate in regular safety audits and risk assessments to identify and mitigate potential hazards.

• Master’s degree or higher in Electrical Engineering, Materials Science, Chemical Engineering, or a related field.
• Minimum of 3 years of experience in semiconductor manufacturing with a focus on power module packaging.

• PhD degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related field.
• Experience with GaN and SiC power module manufacturing and packaging technologies.
• Familiarity with industry standards…