Head of Chip Cooling & Fast Thermal Simulation — Equity
Listed on 2026-10-30
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Engineering
Systems Engineer, Electronics Engineer
Flexcompute is a high-growth technology startup redefining engineering simulation for the semiconductor industry. We seek a visionary Lead to guide thermal management strategy, product roadmap, and technical direction for liquid cooling, immersion systems, and advanced heat sinks in AI and HPC hardware.
The ideal candidate holds a PhD or MS, 8+ years in thermal management for electronics, and expert-level experience with thermal simulation tools, ready to lead a team of engineers and engage with
This opportunity is for the Head of Chip Cooling & Fast Thermal Simulation — Equity role at Flexcompute, inc.
This opportunity is part of our work in Engineering.
The advertised compensation is 180..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
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