Senior Multi-Layer PCB Designer -Density Boards
Listed on 2026-10-16
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Engineering
Electronics Engineer
Microsoft in Redmond seeks an experienced PCB Design Engineer to own complex PCB layouts from requirements through release, including placement, routing, stack-up, impedance, and DFM. You will collaborate with electrical, mechanical, and manufacturing teams to translate schematics into manufacturable boards and drive robust release packages.
Ideal candidates blend strong multi-layer PCB knowledge with signal integrity, impedance control, and high-density interconnect expertise, and can leverage
The following opening is for a Senior Multi-Layer PCB Designer for High-Density Boards with Microsoft.
The position is based in Redmond, WA, United States.
This opportunity is part of our work in Marketing & Media, Engineering.
The advertised compensation is 130..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the Senior Multi-Layer PCB Designer for High-Density Boards role in the description above.
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