Principal Package Engineer

Job d:

Location:

United States, Washington, Redmond Salary: USD $142,800 - $274,800 per year

Employment type:

Full-Time Work site: 3 days / week in-office

Role type:
Individual Contributor Travel:
Less than 25%
Profession:
Hardware Engineering Discipline:
Silicon Engineering Company:
Microsoft Overview Microsoft  Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, One Drive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions.

Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.

The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantages to Microsoft and enable our customers to achieve more.

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing and Product Engineering (SMPE) team is instrumental in defining and elivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware.

We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure. We are looking for a Principal Package Engineer to join the team to support our mission as a key role with advanced packaging technology selection, qualification, and manufacturing.

Responsibilities Theprincipal package engineer will be responsible for providing expertise, insight, and support to the Silicon development team through the entire life cycle of the product.  In this role, you will be responsible for supporting the design and implementation of new custom Silicon devices, evaluation and recommendation of new packaging technology, Substrate design support, device/package qualification, supplier assessment, manufacturing bring up, and driving quality/reliability in development and production.

Drive optimal silicon packaging solution supporting Azure datacenter product roadmap.

Drive package technology for chiplet architecture with advanced 2.5D/3D packaging.

Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeout

Define, design and develop test vehicles to validate Silicon, Package, System performance.

Drive supplier assessments and manage suppliers through definition, development, qualification and production.

Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.

Define EDA tools requirements for advanced 3

DIC packaging designs

Design and develop package and assembly drawings to support the manufacturing.

Lead supplier assessments and manage suppliers through definition, development, qualification and production.

Assess and characterize the reliability of Integrated Circuits (IC) packages.

Design and develop package and assembly drawings to…