Mechanical Engineering - Thermal Hardware and Analysis, Space

Mechanical Engineering - Thermal Hardware and Analysis, Space

Join to apply for the Mechanical Engineering - Thermal Hardware and Analysis, Space role at Logos Space
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Logos Space is a Low Earth Orbit (LEO) satellite system purpose-built to serve the connectivity needs of commercial enterprise users and government users. We provide resilient, high-performance satellite-based connectivity services. Business customers have contracts with agreed-upon performance standards for broadband, and Logos builds these capabilities into the system from the beginning. Speed and reliability are the foundation of the system. Logos is designed to extend cloud and data center network connectivity worldwide to fixed, seaborne, and airborne terminals.

Logos is led by a team of highly experienced engineers with proven track records in the networking and satellite industries.

The Mechanical Engineering team at Logos Space work on design, development, flight validation, assembly, integration, test, and in-flight success of the logo fleet of spacecraft. The development of suitable facilities and required ground support equipment also falls within the purview of the ME team. Mechanical engineers support both bus and payload activities from idea stage to flight.

We seek engineers who thrive in a fast-moving environment, comfortable taking vague design ideas and turning them into tangible hardware ready for test and flight. We are looking for engineers who love solving hard problems.

• Develop detailed thermal models of spacecraft components, subsystems, and integrated systems using industry-standard software (e.g. Ansys Thermal Desktop, NX Space Systems Thermal, FEMAP/NASTRAN, etc.).
• Perform comprehensive thermal analyses (steady-state, transient, worst-case) considering various orbital environments, attitudes, and operational modes.
• Correlate thermal models using test data to refine analytical predictions.

• Design, select, and specify passive thermal control hardware (MLI, radiators, heat pipes, coatings, fillers, doublers).
• Design, select, and specify active thermal control hardware (heaters, thermostats, sensors, fluid loop components).
• Oversee the procurement, manufacturing, and integration of thermal control hardware.
• Work hands‑on with technicians and integration teams during the build and testing phases.

• Develop detailed thermal test plans and procedures for component, subsystem, and system-level testing, including thermal vacuum (TVAC) and thermal balance tests.
• Provide oversight and hands‑on support during thermal hardware integration and testing activities.
• Analyze test data, troubleshoot anomalies, and correlate thermal models to test results for validation.

• Collaborate closely with Systems, Mechanical, Electrical, Power, Propulsion, and Avionics teams to define thermal requirements, interfaces, and ensure system compatibility.
• Prepare and present comprehensive thermal design documentation, analysis reports, and test reports for internal reviews and customer milestones.
• Stay current with advancements in thermal control technologies, materials, and analysis techniques.

• Bachelor of Science (BS) degree in Mechanical Engineering, Aerospace Engineering, or a closely related field with a strong emphasis on thermodynamics and heat transfer.
• 3+ years of professional experience demonstrating expertise in both:
  • Thermal analysis and modeling using industry-standard software (e.g. Ansys Thermal Desktop, NX Space Systems Thermal, FEMAP/NASTRAN, etc.).
  • Thermal hardware design, selection, integration, and/or testing within the aerospace or spacecraft industry.
• Solid understanding of heat transfer principles (conduction, convection, radiation) and thermodynamics, particularly as applied to the space environment.
• Proven ability to translate analysis results into practical hardware solutions.
• Familiarity with spacecraft thermal control hardware (passive and active).
• Experience with CAD software (e.g., Solid Works, Creo, NX) for geometry manipulation and interfacing with thermal models.
• Strong…