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Electrical Engineer III - Hardware - Reston, VA
Job in
Reston, Fairfax County, Virginia, 22090, USA
Listed on 2026-01-01
Listing for:
Kopin Corporation
Full Time
position Listed on 2026-01-01
Job specializations:
-
Engineering
Electrical Engineering, Systems Engineer
Job Description & How to Apply Below
Electrical Engineer III - Hardware - Reston, VA
The Electrical Engineer III with a focus in hardware design is responsible for designing, implementing, and validating custom electronics used in Kopin’s microdisplay-based systems. This includes driver boards, interface modules, imaging subsystem electronics, and system-level hardware for weapon sights, HMDs, medical viewers, FPV goggles, and related embedded platforms.
The Electrical Engineer III performs PCB-level design with substantial independence, executes detailed hardware analysis, and participates in cross‑functional integration with systems, firmware, optics, and mechanical engineering.
Core responsibilities include:
- Architect and design custom PCB assemblies for microdisplay driver and timing boards, sensor/IMU and camera interface boards, and control and communication modules for integration into weapon, aircraft, or host systems.
- Perform schematic capture and component selection (FPGAs, MCUs, power ICs, regulators, ADC/DACs, serialize rs/deserializers, level translators) with consideration for SWaP, cost, and component availability.
- Design robust power distribution networks for portable and vehicle‑powered electronics, including DC‑DC converters, sequencing, protection circuitry, and efficiency optimization.
- Implement and validate high‑speed and mixed‑signal interfaces including LVDS, MIPI, HDMI/DP, SPI/I²C, UART, USB, GPIO, and embedded sensor interfaces.
- Define and document electrical interfaces to optics, mechanics, and firmware teams, including pinouts, timing requirements, EMI/ESD concerns, connector/harness guidelines, and interface constraints.
- Support or execute PCB layout in Altium, including stack‑up development, controlled‑impedance routing, placement for thermal behavior, and manufacturability considerations.
- Execute board bring‑up and debug: power‑on sequencing, functional validation, and test‑point evaluation; signal integrity, timing closure, and digital interface reliability; integration with firmware, FPGA logic, optics modules, and sensors.
- Conduct environmental and thermal stress testing where applicable.
- Build, iterate, and characterize lab prototypes and test fixtures for concept evaluation and verification.
- Generate and maintain engineering documentation such as schematics, BoMs, design reports, ECOs, test procedures, and revision‑controlled hardware artifacts.
- Work closely with Systems, Embedded Software, Optics, and Mechanical Engineering to ensure system‑level functionality, performance margins, and requirement compliance.
- Participate in DFM/DFT reviews and support NPI activities with manufacturing partners and contract assemblers.
MINIMUM
JOB REQUIREMENTS:
- Bachelor’s degree in Electrical Engineering or related field.
- 5–8 years of experience in PCB-level hardware development for embedded systems.
- Proficiency with Altium Designer or comparable schematic/layout tools.
- Demonstrated experience with power supply design (buck/boost, PMICs, protections).
- High-speed digital interfaces and mixed‑signal board design.
- FPGA/MCU-based board implementation and bring‑up.
- Strong hands‑on lab experience (oscilloscopes, logic analyzers, power analyzers, JTAG, rework).
- Ability to execute designs independently from concept through prototype validation.
- Strong written and verbal communication skills and ability to participate in technical design reviews.
- Kopin is a defense contractor and is subject to ITAR. You must be a U.S. citizen or permanent resident (green card holder).
PREFERRED
JOB REQUIREMENTS:
- Experience with near‑eye displays, AR/VR devices, imaging sensors, or HUD/HMD electronics.
- Experience with SI/PI tools and SPICE or behavioral modeling.
- EMC/EMI compliance and rugged‑environment hardware design.
- Flex circuit design experience, including rigid‑flex stack‑ups, impedance control, bend‑radius constraints, and miniature connector selection.
- Basic embedded engineering familiarity, including MCU/SoC architectures, firmware integration considerations, and power/control sequencing.
- Working knowledge of embedded communication protocols (LVDS, MIPI‑DSI/CSI, HDMI/DP, USB, GPIO, and peripheral buses).
- Experience in small‑to‑mid‑size R&D environments…
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