HBM Core-Die Architect & Circuit Design Lead
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Design & Architecture
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Engineering
Job Description & How to Apply Below
Micron Technology, Inc. seeks a dedicated HBM Core-Die Architecture & Circuit Design Engineer to own core-die architecture and critical DRAM circuit design impacting bandwidth, power, and reliability.
You will drive architecture definition and ARD development for advanced 3D-stacked HBM products and collaborate across multiple teams to ensure successful silicon bring-up and verification. The role requires hands-on circuit design expertise, SPICE-based simulation proficiency, and a track record
Step into the HBM Core-Die Architect & Circuit Design Lead role at Micron Technology, Inc. in Richardson, TX, United States and grow with us.
Join us at Micron Technology, Inc. as our next HBM Core-Die Architect & Circuit Design Lead in Richardson, TX, United States.
We are currently recruiting a HBM Core-Die Architect & Circuit Design Lead for our team in Richardson, TX, United States.
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