Process Engineer

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Functional Area: Engineering
Career Stream: Process Engineering Manufacturing
SAP Short Name: ENG-ENG-PRM
Job Level: Level 07
IC/MGR: Individual Contributor
Direct/Indirect Indicator: Indirect

Why Celestica?

Celestica is changing the future! We are imagining, developing and delivering a better future with our customers.

At Celestica, we foster a motivated, high-integrity work environment based on a strong set of corporate Values. These Values empower our employees to provide you with superior service.

We are obsessed with uncovering the information and insights that allow us to anticipate and overcome the challenges of the future.

Bold Conviction

We dare to envision new solutions, new technologies, new ways of working and invest to make it a reality.

Unwavering Dedication

We exemplify teamwork and commitment in every decision and every action to be the best partners to our customers and our colleagues.

The Manufacturing Process Engineer is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customer’s products.

Performs tasks such as, but not limited to, the following:

Design, develop, and implement new manufacturing processes to support customer products.

Develop application software and tooling for a series of complex machines and mechanical process steps within a manufacturing sector.

Execute with support, capability of machines and process steps using Design of Experiments and statistical methods to ensure maximum utilization of critical resources, maximum throughput, minimum cost and capacity growth; involves integrating equipment, people, material flow, and information systems.

Solve technical product, process, component, and related problems that affect the efficient operation and/or manufacture of products.

Provide feedback to product designers on suitability of designs for manufacturability with supervision.

• NPI-PCBA: ESD, Component Prep, Laser making, Solder Paste Deposition/Setencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT/PTH manual/automated rework, cleaning processes, coating/potting underfill/ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacutring Operational management, DFM
  -Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA
• DFX: ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense/Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly/Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assembly, Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills/Edge bonding/Potting, Pack and Ship, Chassis Assembly, Sheet Metal, Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe)
• FA LAB: ESD Controls, Solder Metallurgy, Straing Guage Analysis, SIR Testing, Solder Joint Reliability Modeling, Sample Prep (Grind and Polish), Dye & Pry, CMM/VMM, Lab Xray, Pull/Bend Testing, Vibration Testing, Drop Testing, TDR, XRF, SEM, FTIR, IC, Solderability Testing, Thermal Analysis, HALT/HASS, TH&B, Thermal Shock, ATC
• OPTICAL & XRAY INSPECTION: ESD Controls, Auto Wire Prep, SMT Data Analytics, API, AOI (PCBA), AXI (PCBA), AOI (System), Test Strategy Creation, IPC-610, Quality Dat (KPI), DFM - Manufacturing, DFA-Assembly, DFT/Physcial Test, DFT-Electrical Test
• MACHINING & OTHER:
  
  ESD Controls, Pack & Ship, CNC programming, Secondary Processing, Sheet Metal, Machining, Welding, DFM-Manufacturing
• MECHANICAL & SYSTEMS ASSEMBLY: ESD Controls, Wire Harness Assembly, Auto Wire Prep, Mechanical Assembly - System Build, OEE / Industrical Engineering, Pack & Ship, Vacuum System, Fluidics, Electrical Encolsure, Cable Routing, Electrical - Automation, Mechanical - Automation, Machine Vision, IPC-610, Engineering Controls, Quality Data (KPI), Manufacturing Operational Management, DFM - Manufacturing, DFA - Assembly, DFAA - Automated Assembly, DFT - Physical Test
• PCBA ASSEMBLY: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening/jetting)/Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics
• MICROELECTRONICS: ESD Controls, Wafer thinning, Wafer Singulation, Edge…