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Sr Mechanical Design Engineer

Job in Richardson, Dallas County, Texas, 75080, USA
Listing for: Qorvo, Inc.
Full Time position
Listed on 2025-12-19
Job specializations:
  • Engineering
    Electronics Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 90000 - 120000 USD Yearly USD 90000.00 120000.00 YEAR
Job Description & How to Apply Below

Sr Mechanical Design Engineer

Location:

Richardson, TX, US, 75081

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit  to learn how our innovative team is helping connect, protect and power our planet.

Job Description:

Qorvo is looking for an experienced Sr Mechanical Design Engineer to join the Defense & Aerospace product development team. The successful candidate will lead mechanical design and development efforts of RF power amplifiers for defense communications, radar and electronic warfare applications.

Responsibilities
  • Senior level Mechanical Engineer developing next generation microelectronic packaging technology integrating RF, analog, and digital technology semiconductor devices.
  • Chosen candidate will work closely with select team of IC designers, circuit designers, process engineers, and CAD tool set specialists to develop products and development tools to move state of the art packaging technology forward.
  • Using FEA and other industry standard simulations tools:
    Perform detailed modeling and optimization of thermal/mechanical design at the die/package/board level.
  • Perform mechanical stress modeling and optimization at the die/package/board level.
  • Develop measurement and modeling tools to support thermal and stress analysis for internal and external customers.
  • Guide package and substrate design decisions that meet performance specifications and yield requirements.
  • In conformance with Qorvo standards, develop and document new products for prototype, limited production, and production release.
  • Supervise and respond to manufacturing issues as they occur.
  • Maintain view of packaging technology trends across GaN, GaAs, Digital Si, and Analog Si. Provide inputs to implement these technology trends.
  • Support external customers with applications thermal models and failure analysis support.
Qualifications
  • BSME/MSME degree in mechanical engineering or other relevant field with a minimum of 5 years’ experience in semiconductor packaging.
  • Experience in the design of packaged microelectronic assemblies for the defense, avionics, aerospace, or automotive industries.
  • Expert level skill with ANSYS and Solidworks, or similar.
  • Knowledge of legacy and advanced microelectronic package technologies for commercial, defense, and aerospace markets including materials, manufacturing methods, plating, sealing, and interconnect technologies.
  • Experience with microelectronic package assembly processes including die attach, wire bond, flip chip, epoxy dispense, encapsulation, and solder reflow.
  • Knowledge of microelectronic inspection tools and equipment including capabilities and limitations. Similar knowledge of failure analysis techniques and equipment.
  • Knowledge of reliability calculation methods for semiconductors.
  • Understanding of GD&T, ANSI standards and tolerance stack-ups required.
  • Demonstrated ability to work with cross-functional teams.
  • Excellent verbal communication and interpersonal skills.
  • Excellent written communication skills.

This position is not eligible for visa sponsorship by the Company.

Make a Difference at QORVO

We are Qorvo. We do more than create innovative RF and power solutions for the mobile, defense, and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

Equal

Employment Opportunity

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.

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