Senior Lead Engineer, Manufacturing Process

Senior Lead Engineer, Manufacturing Process

Region:
Americas
Country: USA
State/Province:
Texas
City:
Richardson

Functional Area:

Engineering
Career Stream:
Process Engineering Manufacturing
SAP Short Name: SLE-ENG-PRM
Job Level: Level 09
IC/MGR:
Individual Contributor
Direct/Indirect Indicator:
Indirect

Celestica is changing the future! We are imagining, developing and delivering a better future with our customers.
At Celestica, we foster a motivated, high-integrity work environment based on a strong set of corporate values. These values empower our employees to provide you with superior service.
Relentless Curiosity:
We are obsessed with uncovering the information and insights that allow us to anticipate and overcome the challenges of the future.
Bold Conviction:
We dare to envision new solutions, new technologies, new ways of working and invest to make it a reality.
Unwavering Dedication:
We exemplify teamwork and commitment in every decision and every action to be the best partners to our customers and our colleagues.

The Senior Lead Engineer - Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality, cost and delivery goals for Celestica and its customers’ products.

• Understand and implement the customer’s technical roadmap and related process development projects.
• Lead and implement the development and release of the full manufacturing process for new customer products.
• Provide feedback on customer’s technical requirements to team members and management.
• Develop and implement costed and optimized feedback using Design for Manufacturability (DFX) tools and processes to reduce cost and improve quality and reliability.
• Plan and lead the assessment of the capability of process applications using Design of Experiments.
• Devise process controls and data collection strategies and evaluate complex data for yield, reliability and root cause analysis.
• Ensure accurate and timely communication to management on critical technical and business issues.

• NPI-PCBA: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA.
• DFX: ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense / Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly / Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assembly (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding), Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills / Edge bonding / Potting, Pack and Ship, Chassis Assembly (fluidics, electrical enclosure, cable routing), Sheet Metal , Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe)
• FA LAB : ESD Controls, Solder Metallurgy, Strain Gauge Analysis, SIR Testing, Solder Joint Reliability Modeling, Sample Prep (Grind and Polish), Dye & Pry, CMM/VMM, Lab X-Ray, Pull/Bend Testing, Vibration Testing, Drop Testing, TDR, XRF, SEM, FTIR, IC, Solderability Testing, Thermal Analysis, HALT/HASS, TH&B, Thermal Shock, ATC
• OPTICAL & XRAY INSPECTION : ESD Controls, Auto Wire Prep, SMT Data Analytics, API, AOI (PCBA), AXI (PCBA), AOI (System), Test Strategy Creation, IPC-610, Quality Dat (KPI), DFM - Manufacturing, DFA - Assembly, DFT / Physical Test, DFT - Electrical Test
• MACHINING & OTHER : ESD Controls, Pack & Ship, CNC programming, Secondary Processing, Sheet Metal, Machining, Welding, DFM - Manufacturing
• MECHANICAL & SYSTEMS ASSEMBLY : ESD Controls, Wire Harness Assembly, Auto Wire Prep, Mechanical Assembly - System Build, OEE / Industrial Engineering, Pack & Ship, Vacuum System, Fluidics, Electrical Enclosure, Cable Routing, Electrical - Automation, Mechanical - Automation, Machine Vision, IPC-610, Engineering Controls, Quality Data (KPI), Manufacturing Operational Management, DFM - Manufacturing, DFA - Assembly, DFAA - Automated Assembly, DFT - Physical Test
• PCBA ASSEMBLY : ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH…