Design Lead; HBM​/Advanced Memory Design

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated Design Lead to lead the architecture, design, integration, and execution of next‑generation HBM and advanced memory products.

The successful candidate will drive multi‑functional collaboration across Building, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high‑quality silicon on aggressive schedules.

• Lead the design and execution of complex memory subsystems and top‑level integration activities.
• Own design planning, technical decision‑making, risk assessment, and schedule execution.
• Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability.
• Review design specifications, microarchitecture documents, and implementation plans.
• Drive RTL, mixed‑signal, memory controller, PHY, or custom circuit design activities depending on project needs.
• Lead design reviews and drive issue resolution across organizations.
• Mentor early‑career engineers and provide technical leadership to project teams.
• Define and improve develop methodologies applying AI‑enabled tools, automation, and standard processes.
• Support silicon bring‑up, debug, characterization, and yield improvement activities.
• Communicate project status, risks, and mitigation plans to management and collaborators.

• BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.
• 15+ years of semiconductor design experience (adjust per internal leveling guidelines).
• Demonstrated experience leading complex IC development programs.
• Strong understanding of digital and/or custom circuit design methodologies.
• Experience with: RTL design (Verilog/System Verilog);
  Timing closure and physical implementation concepts;
  Verification and debug flows; DFT and silicon validation;
  Power, performance, and area optimization.

• Experience with DRAM, DDR, HBM, LPDDR, or advanced memory products.
• Experience leading global multi‑functional teams.
• Knowledge of advanced process nodes and design‑for‑manufacturing concepts.
• Experience with Synopsys and Cadence implementation flows.
• Familiarity with package integration, 2.5D/3D stacking, TSV, and advanced packaging technologies.
• Strong track record of successful product tape‑outs.

• Technical ownership of major product work.
• Lead without direct authority across multiple organizations.
• Influence architecture and technology decisions.
• Mentor and develop engineering talent.
• Drive execution excellence and accountability.

• Delivery of build achievements on schedule.
• Silicon quality and first‑pass success.
• Technical innovation and problem‑solving.
• Multi‑functional collaboration efficiency.
• Mentorship and team impact.

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.

Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on

Micron is proud to be an equal opportunity workplace and is an…