HBM Design Architecture Intern — AI Memory & Systems
Listed on 2026-10-11
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Engineering
AI Engineer (Applied/Software) -
Research/Development
Micron Technology, Inc. is seeking an HBM Design Architecture Intern to assist in research and performance modeling for next‑generation AI memory systems. You will work with senior engineers to analyze bandwidth and latency, refine simulators, and build trend dashboards using industry datasets.
The internship emphasizes hands-on exposure to AI system trends, memory subsystem analysis, and collaboration with mentors to shape future architectural decisions at Micron.
Join us at Micron Technology, Inc. as our next HBM Design Architecture Intern — AI Memory & Systems in Richardson, TX, United States.
Full responsibilities and requirements are described in the listing above.
Learn more about the HBM Design Architecture Intern — AI Memory & Systems role in the description above.
We appreciate your interest in this position.
Join Micron Technology, Inc. and contribute to our ongoing work.
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