HBM DFT Engineer — Tape Test Innovation
Listed on 2026-10-17
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Engineering
Test Engineer, Electronics Engineer, Quality Engineering, Hardware Engineer
Micron Technology, Inc. seeks an Engineer – HBM Design for Test (DFT) to define, implement, integrate, and support DFT solutions across HBM cores and base dice for current and next-gen products.
The role drives defined DFT architectures, collaborates with multi-functional teams, and ensures DFT features meet test, quality, and manufacturability requirements, supporting tape-out, silicon bring‑up, and qualification.
As a HBM DFT Engineer — Tape-Out & Test Innovation, you will play an important part at Micron Technology, Inc. in Richardson, TX, United States.
The position is based in Richardson, TX, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 140..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the HBM DFT Engineer — Tape-Out & Test Innovation role in the description above.
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