Mts - Hig Hbm - Architecture

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The High-Performance Integrated Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications! Our ultimate goal is to deliver the lowest power per bit solutions in the industry!

Position Overview:

We are searching for an HBM IO Design Architecture Engineer. This role will focus on HBM IO / TSV IO design and analysis including electrical modeling, Signal Integrity (SI) and Power Integrity (PI) analysis, and design optimization across the HBM development cycle.

The ideal candidate brings hands-on experience in design execution, simulation to silicon correlation, and cross-functional methodology development, and embraces AI-driven analysis and data-driven decision making to accelerate quality improvement cycles.

Responsibilities will include, but are not limited to:

High-speed IO design architecture for HBM products

Define and standardize IO design quality process from architecture to silicon

Define IO architecture, TSV IO performance targets, and design quality requirements for future HBM products.

Develop IO and TSV modeling methodologies to support architecture tradeoff analysis, SI/PI evaluation, and design optimization.

Drive simulation-to-silicon correlation and post-silicon learning feedback to improve design quality across HBM product generations.

Leverage AI Assisted analytics to accelerate root cause identification from complex multi-variable silicon data Successful candidates for this position will have:

Good IO circuit design background with familiarity of both, analog and digital design and simulation experience required

Experience with circuit verification and optimization including layout verification and parasitic extractions of the circuits

Good understanding on state-of-the-arts device characteristics and hands-on design experience

Excellent problem-solving and analytical skills

Strong documentation skills

Strong communication skills with the ability to clearly convey sophisticated technical concepts to other design peers both verbally and written

Prior circuit debug experience through Product Engineering or equivalent preferred

Knowledge of advanced packaging environments (CoWoS, HBM stack, D2D, etc)
Required Experience MS or PhD in EE10+ years of relevant Engineering or Design Engineering experience on high-speed IO, PLL, Tx, Rx, Equalization, clock tree Familiarity with one or more high-speed interfaces such as HBM, DDR, UCIe, PCIe, or MIPI.Job title and level can scale depending on experience and qualifications

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on  is proud to be an equal opportunity workplace and is an affirmative action employer.

All qualified applicants will receive…