Senior Thermal Simulation Engineer .5D/3D Packaging
Listed on 2026-10-18
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Engineering
Mechanical Engineer, Packaging Engineer
Micron Technology, Inc. in Richardson, TX is seeking an MTS - Thermal Simulation Engineer to lead high-fidelity thermal and thermo-mechanical modeling for next-generation HBM products.
You will define simulation strategies, drive physics-based models, and collaborate with product, packaging, and test teams to optimize performance. The role requires a PhD with 5+ years or a Master's with 10+ years in mechanical engineering or related fields, plus extensive experience with Ansys, Abaqus, Fluent,
For the Senior Thermal Simulation Engineer for 2.5D/3D Packaging position at Micron Technology, Inc., we are reviewing applications now.
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This posting is for the Senior Thermal Simulation Engineer for 2.5D/3D Packaging role at Micron Technology, Inc., based in Richardson, TX, United States.
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