MTS - Thermal Simulation Engineer

JR114769 MTS
- Thermal Simulation Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG) and develops industry-leading High Bandwidth Memory (HBM) solutions for next-generation AI and high-performance computing systems.

Micron is hiring an experienced MTS
- Thermal Simulation Engineer! You would provide technical leadership in advanced thermal and thermo-mechanical modeling for next-generation High Bandwidth Memory (HBM) products. This role will define simulation strategy, solve complex thermal challenges across 2.5D/3D semiconductor packaging systems, drive physics-based model development and silicon correlation, and influence product, package, material, and process decisions across teams.

• Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system-level integration.
• Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses to evaluate performance, identify risks, and guide architecture and design decisions.
• Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across complex stacked memory architectures.
• Lead simulation-to-silicon correlation with characterization and test teams, establish model validation criteria, and drive closure of gaps between prediction and measured behavior.
• Assess material properties, layout effects, package architecture, and manufacturing variation to identify key drivers of thermal resistance and hotspot behavior
• Influence design, packaging, process, and test teams by translating simulation results into thermally-aware product requirements and design direction
• Advance modeling methodologies, automation, and scalable simulation frameworks for HBM and advanced packaging technologies, while mentoring engineers and establishing guidelines.
• Lead the evaluation, adoption, and responsible use of AI-enabled solutions within engineering workflows, translating emerging AI capabilities into practical business value through improved productivity, innovation, quality, and speed of execution

• PhD plus 5 years of industry experience, or Master’s degree plus 10 years of industry experience, in Mechanical Engineering, Materials Science, Physics, or a related field
• Extensive industry experience in thermal simulation or multiphysics modeling for semiconductor devices, advanced packaging, or closely related technologies
• Strong foundation in heat transfer, thermodynamics, and solid mechanics
• Hands-on experience with multiphysics simulation tools (e.g., Ansys, Abaqus, Fluent, Star-CCM+, FloTHERM)
• Demonstrated expertise in modeling and interpreting thermo-mechanical phenomena such as thermal resistance, heat spreading, stress, warpage, and material interaction effects
• Advanced experience with finite element modeling (FEM), coupled thermal-structural simulations, model calibration, and technical problem solving for complex systems

• Understanding of semiconductor packaging technologies, including HBM, 2.5D/3D integration, TSVs, hybrid bonding, and interposers
• Familiarity with material characterization and effective thermal property extraction across layered or heterogeneous systems
• Knowledge of simulation-to-silicon calibration workflows and experimental validation techniques
• Exposure to…