Design Lead; HBM​/Advanced Memory Design) Richardson, Texas, Posted

Position: Design Lead (HBM/Advanced Memory Design) Richardson, Texas, United States of America Posted a day ago
## Design Lead (HBM/Advanced Memory Design)
Richardson, Texas, United States of America Apply Now Find out how well you match with this jobJob :
JR113294
** Our vision is to transform how the world uses information to enrich life for
* all*.
** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are seeking a highly motivated
** Design Lead
** to lead the architecture, design, integration, and execution of next-generation HBM and advanced memory products. The successful candidate will drive cross-functional collaboration across Design, Verification, Layout, CAD, Product Engineering, and Technology Development teams to deliver high-quality silicon on aggressive schedules.
** Key Responsibilities
*** Lead the design and execution of complex memory subsystems and top-level integration activities.
* Own design planning, technical decision-making, risk assessment, and schedule execution.
* Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability.
* Review design specifications, microarchitecture documents, and implementation plans.
* Drive RTL, mixed-signal, memory controller, PHY, or custom circuit design activities depending on project needs.
* Lead design reviews and drive issue resolution across organizations.
* Mentor junior engineers and provide technical leadership to project teams.
* Define and improve design methodologies utilizing AI-enabled tools, automation, and best practices.
* Support silicon bring-up, debug, characterization, and yield improvement activities.
* Communicate project status, risks, and mitigation plans to management and stakeholders.
** Required Qualifications
*** BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.
* 8+ years of semiconductor design experience (adjust per internal leveling guidelines).
* Demonstrated experience leading complex IC development programs.
* Strong understanding of digital and/or custom circuit design methodologies.
* Experience with:  + RTL design (Verilog/System Verilog)  + Timing closure and physical implementation concepts  + Verification and debug flows  + DFT and silicon validation  + Power, performance, and area optimization
* Strong communication, leadership, and project management skills.
** Preferred Qualifications
*** Experience with DRAM, DDR, HBM, LPDDR, or advanced memory products.
* Experience leading global cross-functional teams.
* Knowledge of advanced process nodes and design-for-manufacturing concepts.
* Experience with Synopsys and Cadence implementation flows.
* Familiarity with package integration, 2.5D/3D stacking, TSV, and advanced packaging technologies.
* Strong track record of successful product tape-outs.
** Leadership Expectations
*** Technical ownership of major product deliverables.
* Lead without direct authority across multiple organizations.
* Influence architecture and technology decisions.
* Mentor and develop engineering talent.
* Drive execution excellence and accountability.
** Success Metrics
*** Delivery of design milestones on schedule.
* Silicon quality and first-pass success.
* Technical innovation and problem solving.
* Cross-functional collaboration effectiveness.
* Mentorship and team impact.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their…