HBM Thermal Integration Engineer — Optimize
Listed on 2026-10-20
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Engineering
Mechanical Engineer, Systems Engineer, Test Engineer, Electronics Engineer
Micron Technology, Inc. seeks an experienced MTS - HBM Thermal Integration Engineer to optimize thermal performance for next-generation High Bandwidth Memory products.
The role intersects thermal simulation, silicon characterization, process technology, packaging, manufacturing, and product engineering. You will develop DOE-based strategies, analyze extensive data, and collaborate across wafer fabrication, package development, and reliability teams to drive design improvements and reduce thermal
Join us at Micron Technology, Inc. as our next HBM Thermal Integration Engineer — Optimize Performance in Richardson, TX, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 120..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
Learn more about the HBM Thermal Integration Engineer — Optimize Performance role in the description above.
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