Sr. CAD Engineer

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.

Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition

Job Description:

The Staff ECAD Engineer is the technical lead for PCB design and fabrication across all high performance RF and power product lines, combining master level CAD/layout expertise with deep IPC knowledge. This individual contributor role sets standards and design rules, resolves the most complex signal integrity, power integrity, and reliability challenges, and drives quality improvements across programs. The role leads through influence, mentoring Staff and Senior engineers and setting technical direction.

• Independently execute end-to-end PCB design using Altium or Cadence tools, including schematic capture and complex PCB layout, from concept to fabrication, assembly, and production builds.
• Set standards, design rules, and IPC compliance practices. Provide sign-off on complex, high frequency PCB designs and fabrication documentation (Altium, Cadence Allegro, ADS, Solid Works, AutoCAD).
• Lead root cause investigation and corrective action for design/fabrication issues involving IPC standards, signal integrity, thermal, and mechanical interactions.
• Provide expert DFM/stack-up guidance from concept through NPI, partnering with RF, Mechanical, Component, and Process Engineering.
• Mentor Staff and Senior engineers as a technical resource and design reviewer across programs.
• Perform pre and post layout SI/PI/EM analysis (Cadence Sigrity or equivalent tools) to validate high speed and high frequency designs.
• Develop transmission line models, impedance controlled routing, crosstalk, and PDN analysis; drive simulation based optimization for DDR4/DDR5, PCIe, Ser Des, Ethernet, USB, and RF interfaces.
• Present simulation findings and risk mitigation recommendations at design reviews.
• Apply HDI techniques for high pin count, fine pitch BGA routing on complex multilayer boards.
• Apply DFx methodologies (DFM, DFA, DFT, DFR) to ensure manufacturability, testability, and reliability.
• Partner with Hardware, Mechanical, Procurement, Manufacturing, and Program Management to align designs with product requirements and schedules.
• Work with suppliers to improve process capability, yield, cycle time, cost, and support qualification and audits of RF/high frequency fabrication partners.
• Prepare and manage complete design documentation packages, including fabrication and assembly drawings, Gerber files, BOMs, and Engineering Change Orders (ECOs), ensuring accuracy and traceability with timely release and smooth transition into manufacturing, while collaborating closely with cross functional stakeholders.
• Manage the lifecycle of Technical Queries (TQs), ensuring timely resolution and clear communication.

• Bachelor's degree in Electrical Engineering, Electronic Engineering, Materials Science, or related field; equivalent extensive practical experience considered in lieu of degree.
• 15+ years of combined experience in PCB/PWB design, CAD layout, and/or fabrication/supplier development, with demonstrated progression into a senior technical role. IPC certification(s) required.
• Deep proficiency with ECAD/mechanical CAD tools:
  Altium, Cadence Allegro, ADS, AutoCAD, Solid Works, and CAM
  350.
• Extensive hands on knowledge of PCB/PWB manufacturing processes, materials, and IPC standards, with proven application of GD&T and DFM/DFA/DFT/DFR principles.
• Strong RF/high frequency design background, including high frequency laminates (Rogers, PTFE/Teflon) and demanding applications such as ATE multisite load boards and probe cards.

• Hands on experience with Cadence Sigrity or equivalent program and related SI/PI/EM…