Principal Engineer HBM Tapeout Execution & Release Coordination

Req  Principal Engineer HBM Tapeout Execution & Release Coordination

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Within Micron’s Heterogeneous Integration Group (HIG), we are developing advanced High Bandwidth Memory (HBM) solutions that enable the next generation of AI, high-performance computing, and data-centric applications.

We are seeking a Principal Engineer!

This role is focused on tapeout governance, release readiness, and execution rigor, from design freeze through final database release.

The HBM Tapeout and Release Technical Lead plays a critical role in ensuring successful design releases into Micron manufacturing. In this role, you will drive tapeout execution, release readiness, and design governance across complex HBM programs, partnering with design, integration, verification, and product teams to deliver high-quality designs on schedule.

• Lead tapeout execution and release coordination for HBM builds, managing schedules, D  achievements, and release readiness
• Drive preparation, review, and completion of tapeout collateral, including TOAST, RCDB, TWIT, and related release documentation
• Coordinate signoff readiness across timing, power, physical verification, integration, and other release-critical activities
• Ensure database quality, completeness, traceability, and signoff evidence are in place prior to tapeout
• Manage release risks, waivers, open items, and governance processes while maintaining strong release discipline across programs

• Bachelor’s degree in Electrical Engineering or a related field, or equivalent experience
• Proven experience with SoC, memory, or semiconductor tapeout execution and design release processes
• Strong knowledge of D  processes, tapeout checklists, release governance, and signoff methodologies
• Hands-on experience preparing or reviewing TOAST, RCDB, TWIT, or equivalent tapeout artifacts
• Demonstrated ability to manage release readiness, risk tracking, and progress in deadline-focused environments

• 10+ years of relevant semiconductor industry experience
• Experience coordinating cross-functional design, verification, physical design, and product engineering teams through tapeout
• Strong analytical, problem-solving, and technical decision-making skills with exceptional attention to detail
• Experience with formal program or project management tools and methodologies
• Experience working with Agentic AI tools to assist with design and verification

Systems Design Engineer 5

Relocation Level: TBD

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.