HBM SoC Physical Design Engineer - Lead Tape PPA
Listed on 2026-11-04
-
Engineering
Electronics Engineer, Systems Engineer, Hardware Engineer
Micron Technology, Inc. in Richardson, Texas is seeking a hands-on HBM/SoC Physical Design Engineer to drive implementation from netlist to GDSII.
You will own blocks or top-level integration, manage floor planning, placement, CTS, routing, and timing closure across MMMC scenarios. The role requires strong experience with EDA tools (Cadence Innovus, Tempus; Synopsys ICC2, Prime Time; Calibre) and a solid grasp of power delivery, IP integration, and signoff.
This is a great opportunity to take on the HBM SoC Physical Design Engineer - Lead Tape-Out & PPA role at Micron Technology, Inc.
The position is based in Richardson, TX, United States.
This opportunity is part of our work in Engineering.
The advertised compensation is 120..
We aim to respond to suitable candidates as soon as possible.
Full responsibilities and requirements are described in the listing above.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).