Principal Packaging Engineer

Required.

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.

Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.

Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition

Job Description:

Description

Qorvo, a part of Skyworks, is seeking a Principal Research Scientist to serve as a Principal Investigator and key individual contributor, providing technical leadership and innovation in RF-based 3D heterogeneous integration (3

DHI). This role is responsible for identifying, developing, and maturing next-generation RF system-in-package (SiP), wafer-level packaging (WLP), and heterogeneous integration technologies that enable future radar, communications, and other emerging applications.

The successful candidate will be a recognized technical leader with a demonstrated track record of innovation, proposal development, funding capture, and technology transition. This individual will lead focused research initiatives, guide small multidisciplinary R&D teams, and collaborate across the organization to deliver high-impact technical outcomes. The role requires the creation of differentiated advanced packaging technologies that enable new product capabilities, accelerate technology adoption, strengthen intellectual property, and contribute directly to Skyworks' long-term commercial success and technology leadership.

• Lead research and technology development in advanced microelectronics packaging, including 3D heterogeneous integration (3
  
  DHI), wafer-level packaging (WLP), and advanced RF packaging technologies.
• Develop innovative concepts, architectures, and integration approaches for RF systems, subsystems, and system-in-package (SiP) solutions.
• Evaluate emerging materials, assembly processes, packaging architectures, and manufacturing technologies to improve RF performance, miniaturization, reliability, and cost.
• Define and execute technology roadmaps aligned with business strategy, product needs, and long-term research objectives.
• Develop RF-enabled heterogeneous integration solutions incorporating semiconductor devices, advanced substrates, embedded passives, antennas, and advanced interconnect technologies.
• Lead modeling, simulation, characterization, and validation activities across device, package, and subsystem levels.
• Collaborate with cross-functional teams including design, materials, manufacturing, reliability, product engineering, and business development organizations.
• Identify, develop, and pursue externally funded research opportunities with government agencies, industry consortia, universities, national laboratories, and strategic partners.
• Serve as Principal Investigator or technical lead on sponsored research programs, ensuring successful execution of technical objectives, schedules, and deliverables.
• Publish technical papers, generate invention disclosures and patents, and present research findings at technical conferences, customer reviews, and industry forums.

• Ph.D. in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or a…