Lead HBM SoC Physical Design Engineer

Micron Technology, Inc. is seeking a hands‑on SoC Physical Design Engineer within the Heterogeneous Integration Group to drive implementation from netlist to GDSII. You will collaborate across RTL, DFT, IP, packaging and manufacturing to ensure best-in-class PPA and robust signoff for tape-out.

The role emphasizes floor-planning, placement, CTS, routing, timing/power integrity, and post‑silicon debug. A strong background in advanced-node PD and DFT coordination is required.

We are seeking a motivated Lead HBM SoC Physical Design Engineer to join Micron Technology, Inc. in Richardson, TX, United States.

This role, Lead HBM SoC Physical Design Engineer at Micron Technology, Inc., could be your next career step.

Are you ready to take on the Lead HBM SoC Physical Design Engineer role at Micron Technology, Inc.?

We would love to welcome a new Lead HBM SoC Physical Design Engineer to our group in Richardson, TX, United States.