HBM SoC Physical Design Engineer — PPA Master

Micron Technology in Richardson, TX, seeks a SoC Physical Design Engineer to lead physical implementation from netlist to GDSII for advanced HBM/DRAM‑adjacent designs. You will work with RTL, verification, DFT, IP, packaging and manufacturing to optimize PPA and ensure robust tape-out.

Responsibilities include floor planning, placement, CTS, routing, clocking and signoff coordination, with a focus on power integrity and resistance to variations.

The HBM SoC Physical Design Engineer — PPA Master role at Micron Technology, Inc. is now open for applications in Richardson, TX, United States.

We are currently recruiting a HBM SoC Physical Design Engineer — PPA Master for our team in Richardson, TX, United States.

This is a genuine position to take on the HBM SoC Physical Design Engineer — PPA Master role at Micron Technology, Inc.

As a HBM SoC Physical Design Engineer — PPA Master, you will play an important part at Micron Technology, Inc. in Richardson, TX, United States.