HBM Design Architect - Lead -Gen Memory Tech

Micron Technology, Inc. in Richardson, Texas, is seeking an HBM Design Architect to lead architecture and feasibility assessments for emerging memories and advanced integration.

You will translate device characteristics into product-level requirements for bandwidth, latency, power, and reliability, guiding de-risking plans with multiple teams. You will partner across process, device, packaging, and design groups to optimize system-level trade-offs and drive roadmap decisions for next-generation

Our group is growing, and we are hiring a HBM Design Architect
- Lead Next-Gen Memory Tech in Richardson, TX, United States.

We appreciate your interest in this position.

Join Micron Technology, Inc. and contribute to our ongoing work.

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This posting is for the HBM Design Architect
- Lead Next-Gen Memory Tech role at Micron Technology, Inc., based in Richardson, TX, United States.